The physical makeup of the board itself plays the dominant role in establishing impedances and signal propagation speeds. It can no longer be an afterthought if one wishes to assure signal integrity. Though your fabricator is more than happy to provide you with a stackup, you need to know what you want before approaching them.
This webinar will guide you through the process of verifying your stackup. The webinar will cover:
Differential pair width/pitch
Optimal via geometry
Using this information, we will perform a time-domain verification using the Simbeor Electromagnetic Analysis Tool. Attending this webinar will give you the tools and knowledge you need to design your stackup and interconnect geometry for first-pass success confidently.