Designing a Stackup for High-Speed Design

The physical makeup of the board itself plays the dominant role in establishing impedances and signal propagation speeds. It can no longer be an afterthought if one wishes to assure signal integrity. Though your fabricator is happy to provide you with a stackup, you need to know what you want before approaching them.

This webinar will guide you through the process of verifying your stackup. The webinar will cover:

  • Material section
  • Differential pair width/pitch
  • Optimal via geometry

We will use this information to perform a time-domain verification using the Simbeor Electromagnetic Analysis Tool. Attending this webinar will give you the tools and knowledge you need to confidently design your stackup and interconnect geometry for first-pass success.

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