The Superstructure PCB

It bears repeating in high-speed design. The board's makeup plays a monumental role in the impedance calculations and provides the structure necessary for signal integrity issues.

We have presented the need for reference planes and tools such as the iCD Design Integrity in the past. In our last webinar (part 2 of the 3-part Practical High-Speed Design series), we provided key points for routing in a high-speed environment. Now it is time to get the nitty-gritty of the PCB superstructure.

In this webinar, presented by our high-speed expert Sean Kelly, we will focus on the materials beyond the traditional FR-4. We will also take a look at the impact that the component packages have on the signal. We will also present various stack-ups that are optimal for high-speed design.

This is part 3 of the "Practical High-Speed Design" series. You can find information on parts 1 and 2 of the series here.

Part 1
Part 2

You can download the list of questions and answers for this webinar here.

Q&A's from Webinar

We provide the video recording of the 3-part webinar series.

Watch the Series